
The industry standard for stochastics measurements
Proven proprietary technologies
In order to optimize and control stochastics, fabs must first measure them accurately. But standard measurement methods cannot provide the accuracy and precision required.
Fractilia solves this problem. By combining the patented fourth-generation FILM™ technology with true computational metrology, Fractilia’s products measure all major stochastic effects simultaneously with the accuracy and precision needed to develop and control manufacturing processes.

Highest-Accuracy Stochastics & CD Measurements
Industry standard - highest accuracy and robustness
Unique physics-based models provide ground-truth measurements
Measure SEM images from any tool vendor and tool model
Automatically deconvolve on-wafer effects from SEM tool noise
19+ patents and hundreds of trade secrets
Lithography and Patterning Expertise
The most accurate rigorous process window analysis
Physics-based prediction of defectivity
Automated analysis of SADP/SAQP processes
Accurate for EUV, High-NA EUV, 193, 193i, 248, i-line processes
Lithography, etch, CVD and other process analysis
Multiple patents
Rigorous Statistical Analysis
More than 250 measurements from every batch of SEM images
Every measurement includes accurate error bars
Accurately compare results from different materials, process steps and SEM tools
Control HVM processes more accurately after removal of SEM noise
FILM™ — an enabling technology
Fractilia’s patented FILM™ technology is a physics-based algorithm for edge detection that rejects noise without resorting to image filtering or smoothing. The result is robust edge detection without modifying the true characteristics of the feature edge you are detecting.
Highest signal to noise
Fractilia’s fourth-generation FILM model provides the highest signal-to-noise of any edge detection methodology in the industry.
Measures and subtracts out SEM errors
The noise in a SEM image adds to the uncertainty of the measurement and produces an inflated, biased result. The amount of this noise changes with nearly everything — process conditions (e.g., dose/focus), feature size, SEM settings, SEM tools, etc. Fractilia solves this problem by measuring the random noise in a SEM image and then statistically removing the noise to produce a far more accurate unbiased measurement. Systematic SEM errors are also measured and removed.
No user-defined parameters
Unlike other tools, Fractilia’s products are self-calibrating and require no user-defined input parameters. This capability allows all measurements to be fully automated and provides the same accurate results across all users. In addition, all measurements and analyses are completely repeatable.
Robust solutions
Our FAME™ and MetroLER™ products also include hundreds of other unique and proprietary capabilities that have been developed and tested on millions of SEM images by customers worldwide over many years. Our attention to detail results in the most accurate, robust and easy-to-use products available.
TOTAL SEM IMAGES MEASURED BY FRACTILIA
(ANNUALLY AT ALL CUSTOMERS)
Fractilia has seen exponential growth in the number of SEM images measured by customers using its products.

Measure the wafer, not the image
Fractilia’s solutions provide:
The de-facto industry standard for unbiased roughness measurements (LWR, LER, PSD(0), etc.)
High-precision CD measurement, with systematic and random SEM errors removed
Extremely accurate measurement of line-end tip-to-tip features with improved repeatability, even for high-noise and low contrast images
Extremely accurate measurement of defectivity for lines/spaces, contacts/pillars and tip-to-tip features for any size data sets up to millions of features
Measurement of local CDU, global CDU, local edge placement error (EPE), pattern placement error and many other key metrics, accurate even for high-noise and low contrast images
More accurate determination of best focus/best dose using Fractilia’s patented Probabilistic Process Window capability
Accurate metrology for large field-of-view images (images with large systematic across-SEM-field variations)
Reduced resist shrinkage by using lower-dose SEM measurements at the same accuracy/precision
More accurate calibration of OPC models
Accuracy on any patterning technology at any node at any process step for both ADI and AEI: EUV, high-NA EUV, 193, 193i, SADP, SAQP, SAOP, DSA, and more
Benefits from R&D through manufacturing
Contact us for more information or to schedule a demonstration.