Fractilia: Pattern Roughness Metrology, by Mark Lapedus in Semiconductor Engineering
Technical papers on pattern roughness from the 2017 SPIE Advanced Lithography Symposium:
Impact of stochastic process variations on overlay mark fidelity at the 5nm node
Michael E. Adel, Chris A. Mack, Sharon Aharon, Dana Klein, Philippe Leray
Line-edge roughness (LER) performance targets for EUV lithography
Timothy A. Brunner, Xuemei Chen, Allen Gabor, Craig D. Higgins, Lei Sun, Chris A. Mack
A chemically amplified resist without catalyst
Austin P. Lane, Wontae Joo, Di Liu, Kensuke Matsuzawa, Ryan A. Mesch, Wade Wang, Benjamin Cassidy, Andrew R. Dick, Scott Phillips, Chris A. Mack, C. Grant Willson
Global minimization line-edge roughness analysis of top down SEM images
Barton G. Lane, Chris A. Mack, Nasim Eibagi, Peter Ventzek
Level crossing methodology applied to line-edge roughness characterization
Chris A. Mack, Timothy A. Brunner, Xuemei Chen, Lei Sun
Using the analytical linescan model for SEM metrology
Chris A. Mack, Benjamin D. Bunday
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